8 Layers 2+4+2 Stack-up
Flip Chip PAD Size:90um
Line Width & Space:40um/40um
Surface Finish: ENEPIG
Package Type:Flip Chip
Copyright Dongguan Kangyuan Electronics Co., Ltd. All Rights Reserved
Telephone: (86-769)8862 8888 Technical support:Ebaixun - Construction of Shenzhen Website