Rigid PCB Capabilities
  Flexible/Rigid-Flex PCB
 
  

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  Current position: >>Engineering Capabilities


Features
Capabilities
Layers
1 to 18 layers
Normal
Base Materials
FR4,High Tg FR4;HF FR4, BT,G10,
Embedded resistor material; Embedded capacitor material.
Base Copper
Thickness
1/3 oz to 6oz
Min. Finished Thickness
0.005”(Double Sided)
0.012”(4 layers)
 0.019”(6 layers)
Max. Panel Size
16*24
Min. Drill Diameter
0.005”(Mechanical Drill)
0.004 ”(Laser Drill)
Embedded Resistor and Capacitor
Yes
Aluminum Composite Panel
Yes
Min. Line Width/Spacing
0.002
Outline Fabrication
Punching, Routing, V-scoringMilling Cavity
Surface Finishing
1) Plated Gold (Flash, Hard or Soft Gold )
2) ENIG
3) ENEPIG   
4) O.S.P
5) Hot Air Solder Levelling ( Lead or Lead-free)
6) Immersion Tin
7) Sliver Ink or Carbon Ink Printing