Rigid PCB capability

Layers

1 to 20 layers

Base Material

FR4, High FR4, Halogen free FR4, BT, G10, High thermal conductive material, Embedded capacitor material, Embedded resistor material, High Frequency material, Metal Core PCB

Base Copper Thickness

2um—210um

Min. Finished Thickness

150μm/6mil (2 layers)

180μm/7mil (4layers)

300μm/11.8mil (6layers)

Max. Panel Size

510mm*610mm/   20inch * 24 inch

Min. Drill Bit Diameter

100μm/4mil(Mechanical Drill); 50μm/2mil(Laser Drill)

Max. Aspect Ratio

16:1

Min. Line Width/Space

25um/25um

Surface Finish

1) Plated Gold

2) ENIG

3) ENEPIG

4) O.S.P

5) Hot Air Solder Levelling (Lead-free)

6) Immersion Tin