Flexible Plate Processing Ability

Features	FPC Capabilities
Layers	1 to 6 layers (Flex Board) 2 to 16 layers (Rigid-Flex Board)

Normal Base Materials	PI、PET、 LCP

Normal BaseCore Thickness	12.5μm、20μm、25μm、 50μm 、75um for Flex

Normal Coverlay Thickness	12.5μm、 50μm

Normal Adhesive Thickness	12.5、20um、25um、35um

Base Copper Thickness	12-70μm RA Copper 6-35μm ED Copper
Stiffener Materials	PI, PET, FR4, SUS, Al-plate, Cu-plate，Ceramic
Min. Finished Thickness	60µm/2.4mil( 1 layer FPC ) 96µm/3.8mil( 2 layers FPC) 250µm/10mil( 4 layers FPC or Rigid-Flex Board) 350µm/13.8mil( 6 layers FPC or Rigid-Flex Board )



Max. Panel Size	250mm500mm/10inch20inch
Min. Drill bit Diameter	125µm/5mil(Mechanical Drill)
	75µm/3mil(CO2 Laser Drill)
	25µm/1mil(UV Laser Drill)
Min. Line Width/ Space	30μm / 30μm
Outline Fabrication	Precision Punching & CNC Routing & CNC Milling & Laser Cutting
Surface Finish	1) Plated Gold ( Flash, Hard or Soft Gold)


	2) ENIG（Soft nickel）

	3) ENEPIG（Soft Nickel or Hard Nickel）

	4) O.S.P
	5) Hot Air Solder Leveling （lead-free）
	6) Immersion Tin / Plating Tin
	7) Silver Ink

Technology