Features | IC substrate capability |
Min. Finished Thickness | 100μm (2 layers) |
180μm (4 layers) | |
260μm (6 layers) | |
Min. Through hole size/pad size | 100um/200um |
Min. Blind hole size/pad size | 55um/115um |
Min. Line Width/Space | 25um/25um |
Surface Finish | 1)Soft Gold |
2) ENIG | |
3) ENEPIG | |
4) O.S.P | |
Process | Tenting |
Etch Back | |
Buss-less | |
MSAP |
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